Thermal Grizzly CPU-jäähdytys - sivu 3

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity.

This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible.

 

• Outstanding thermal conductivity
• Easy to use
• Consistently high performance
• Extreme durability

Attention: Electrically conductive! Follow instructions!

Thermally conductive gap filler to replace GPU thermal pads, with an operating temperature range of -40°C to +120°C.

TG Putty is a thermally conductive compound intended for GPU applications, offered in multiple sizes and performance variants.

• Replaces standard GPU thermal pads to bridge uneven surfaces


• Operating temperature: -40°C to +120°C


• Available contents: 30 g and 100 g


• Available variants: Basic, Advance, Pro


• Datasheet and technical information available for download

Ensures reliable thermal contact across gaps to support heat transfer between GPU components.

Lämpötahna (thermal paste), harmaa, 10ml / 26g

Thermal pads provide improved thermal conductivity and high compressibility for efficient heat transfer in SSDs, GPU coolers, water coolers and other electronic components.

The electrically non-conductive Minus Pad Advance builds on the proven Minus Pad 8 design and was developed to improve thermal conductivity and compressibility while remaining easy to use.

• Excellent thermal conductivity


• High compressibility for uneven surfaces


• Easy to apply and handle


• Electrically non-conductive


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules

Designed for straightforward installation, these pads help maintain effective thermal contact across a range of PC and electronics cooling applications.

Carbonaut pad is a carbon fiber thermal pad, used instead of thermal paste, thermal conductivity: 62.5 W / (mK), size: 51x68 and compatible with AMD TR4 socket

Käytännöllinen AM5-sovittimen ja offset-kiinnityssarjan AMD:n AM5-kantaisiin emolevyihin sisältyy jäähdyttimen kiinnikkeet CPU:n offset-kiinnitystä varten sekä sovitusruuvit UNC 6-32 -kierretapista M3- ja M4-kierretappiin. Sovitusruuveja voidaan käyttää CPU-jäähdyttimien kiinnittämiseen, jotka vaativat M3 tai M4 -kierretapin sen sijaan, että ne olisivat UNC 6-32 -kierrejärjestelmän mukaisia. Offset-telineiden avulla yhteensopivat CPU-jäähdyttimet voidaan valinnaisesti asentaa prosessorille optimoidakseen jäähdytystehokkuutta. Ryzen-prosessoreiden chiplet-suunnittelun esittelyn jälkeen lämpölevyn kuumimman pisteen ei enää ole keskellä, vaan se on hieman alaspäin siirretty ja riippuen prosessorista myös reunalle päin.

12. sukupolven hiomatyökalu on erityisesti suunniteltu Intel 12. sukupolven kontaktikehykselle ja yksinkertaistaa prosessorin hiontaprosessia. Käyttämällä mukana tulevia ruuveja, CPU kiinnitetään helposti hiomatyökaluun kontaktikehyksen kanssa. Tämä simuloi todellista lopullista sijaintia CPU:lle emolevyn pistorasiassa.

The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity.

This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible.

• Outstanding thermal conductivity
• Easy to use
• Consistently high performance
• Extreme durability

Attention: Electrically conductive! Follow instructions!

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity
• High compressibility
• Easy to use
• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.
• Minus Pad Advance: Improved thermal conductivity, higher compressibility.
• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

The Intel 1851 Delid-Die-Mate Heater V1 is a specially designed heating element for the Intel 1851 Delid-Die-Mate V1. The heater raises the temperature of both the CPU and the delidder to 165°C, the necessary temperature for delidding. The operation is controlled via a control unit with an OLED display, which is connected to the heater with two cables. A laptop/smartphone charger with at least 65 watts of power and a USB Type-C connector, which is not included, is required for the heater to operate. A small amount of thermal paste is also needed.

Heating element for warming the CPU
Designed for the Intel 1851 Delid-Die-Mate V1
Follow the warning instructions!
Scope of Delivery:

1x Intel 1851 Delid-Die-Mate Heater V1
1x Angle wrench
1x TG Cleaning Wipes
1x Kryonaut, 1g
Warning Instructions:

Note: When delidding with the Intel 1851 Delid-Die-Mate V1, the CPU should be heated to 165°C (the melting point of indium is 157°C) to liquefy the indium, making it easier to remove the heat spreader. This minimizes mechanical stress on the chip and helps prevent damage. Otherwise, there is a high risk that the CPU could be damaged during delidding.

Caution: delidding a CPU can be dangerous. Any damaged caused by this will not be covered by warranty. Make sure to ressearch how to before trying. 

Lämpöäjohtava sovitinpala (thermal pad), punaruskea

The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity.

This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible.

• Outstanding thermal conductivity


• Easy to use


• Consistently high performance


• Extreme durability
  
  

Attention: Electrically conductive! Follow instructions!

Lämpötahna

Terminen pasta (thermal paste)

Thermal pads offer extremely high thermal conductivity, outstanding compressibility, electrical insulation, and straightforward installation for efficient component cooling.

The Minus Pad Pro is the Pro-series thermal pad refined from the Minus Pad 8 to deliver improved thermal conductivity and compressibility for SSDs, GPU coolers, water blocks and electronic components.

• Excellent thermal conductivity


• Outstanding compressibility for tight contact


• Electrically non-conductive


• Easy to apply


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules

Designed to enhance heat transfer between components and cooling solutions in compact assemblies.

Lämpötahna Polartherm X-8 yhdistää korkean suorituskyvyn ja sähköä johtamattoman silikonin, alumiinin ja alumiinioksidin seoksen 40 g pakkauksessa tehokasta lämmönpoistoa varten.

Monipuoliseksi yleisratkaisuksi suunniteltu matalaviskoosinen koostumus tunkeutuu mikroskooppisiin rakoihin parantaen lämmönsiirtoa komponenttien ja jäähdyttimen välillä, ja sitä voi levittää suoraan tai mukana tulevilla levitysvälineillä ja lastalla tasaisen peiton varmistamiseksi.

• 40 g noin 70–80 levitykseen
• Sähköä johtamaton vähentää oikosulkujen riskiä
• Helppo levitys mukana tulevalla levityssarjalla ja lastalla
• Käyttölämpötila -50 °C – 150 °C

Auttaa täyttämään pienimmätkin raot luotettavaa, tasalaatuista jäähdytystä varten; sopii erityisen hyvin CPU:ille, joiden lämmöntuotto on pienempi.

The Intel 1851 Delid-Die-Mate V1 is a tool for removing the heat spreader (delidding) from Intel processors in the "Intel Core Ultra 200" series (LGA1851 socket). By removing the Integrated Heat Spreader (IHS), CPUs can be cooled using the "Direct-Die" method, where the cooler is mounted directly onto the processor chip. This enables the most efficient transfer of thermal dissipation power (TDP), or simply put, the heat, from the processor to the cooling loop.

 

Caution: Removing the heat spreader (delidding) of a processor is done at your own risk! Delidding the CPU voids the manufacturer's warranty! Damage caused during delidding is not covered by the manufacturer! CPU should be heated. 

Carbonaut-patja on hiilikuituinen lämpöpatja, jota käytetään lämpötahnan sijaan. Lämmönjohtavuus: 62,5 W / (mK), koko: 38x38 ja yhteensopiva Intel LGA20xx -pistokkeen ja AMD AM4 -pistokkeen kanssa.

The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity. This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible.

• Outstanding thermal conductivity
• Easy to use
• Consistently high performance
• Extreme durability

Lämpötyynyt tarjoavat korkean lämmönjohtavuuden erittäin elastisella, joustavalla pinnalla, joka on suunniteltu kompensoimaan jopa pienimmät raot komponenttien välillä.

Thermal Grizzly Minus Pad 8 on helppo käsitellä ja kiinnittää kevyellä paineella. Se käyttää keraamista silikonikaavakompleksia ja nanoalumiinioksidia tukemaan jatkuvaa, optimaalista lämmönsiirtoa laajassa koko- ja paksuusvalikoimassa.

• Korkea lämmönjohtavuus
• Korkea kokoonpuristuvuus
• Sähköinen eristys
• RoHS-yhteensopiva

Luotettava kontakti ja tehokas lämmönsiirto auttavat pitämään herkät komponentit lämpöteknisesti kytkettyinä ja vakaina.

Nestemäinen metalli lämpötahnan levitin (3 kappaleen pakkaus)

Nestemäinen metallijäähdytyspasta, hopeatahna, tiheys: 6,29 g/cm³, käyttölämpötila: -50 - 200°C, 5 grammaa

Lämpöäjohtava sovitinpala (thermal pad)

GPU-virranvalvontalaite mittaa näytönohjaimen virrankulutuksen 12VHPWR-liittimen kautta, näyttää lukemat OLED-näytöllä ja lisää liitännän tunnistuksen, lämpötila-anturit sekä äänimerkkihälytyksen.

Thermal Grizzly 90° WireView Pro GPU kytkeytyy GPU:n 12VHPWR-virtaliittimen ja PSU-kaapelin väliin ja toimii 90°-adapterina kaapeloinnin optimointiin samalla kun se tallentaa ja näyttää teho-, jännite-, virta- ja lämpötila-arvot.

• OLED-näyttö, jossa painikkeella ohjattu vaihto mitattujen arvojen välillä
• Virrankulutuksen mittaus ja tallennus, mukaan lukien tehopiikkien tunnistus
• Sisäiset anturit virtaliittimissä sekä kaksi ulkoista 10K NTC -lämpötila-anturia
• Liitännän tunnistus tunnistaa 150W, 300W, 450W tai 600W virtakaapelin spesifikaation
• Säädettävät lämpötila- ja virtaraja-arvot sekä summerihälytys virheellisille tai löysille liitännöille

Saat selkeämmän käsityksen GPU:n virrankäyttäytymisestä ja liittimien lämpötiloista samalla kun 12VHPWR-kaapelinhallinta pysyy siistinä ja hallittuna.