Thermal Grizzly CPU-jäähdytys - sivu 3

Lämpötyyny tarjoaa poikkeuksellisen korkean kokoonpuristuvuuden ja erinomaisen lämmönjohtavuuden, ja se on suunniteltu silloittamaan vaihtelevia korkeuseroja useissa kosketuspisteissä.

TG Minus Pad High Compression on erityisen käytännöllinen näytönohjainten muokkauksessa GPU-vesijäähdyttimellä tai GPU-jäähdyttimen lämpötyynyjen vaihdossa, jolloin yksi tyynytyyppi voi kattaa samassa kokoonpanossa esimerkiksi VRAM-muistit, jännitteensäätimet ja muut kosketuspinnat.

• Erittäin korkea kokoonpuristuvuus
• Erinomainen lämmönjohtavuus myös voimakkaassa puristuksessa
• Mukautuu hyvin korkeustoleransseihin
• Sähköä johtamaton
• Helppo käsitellä

Ihanteellinen, kun tarkan tyynypaksuuden valinta on epävarmaa; auttaa säilyttämään luotettavan kontaktin ja kompensoimaan toleranssit.

AM5 M4-taustalevy on valinnainen asennuslevy, joka korvaa alkuperäisen AM5-taustalevyn. Joissakin CPU-jäähdyttimissä käytetään asennussarjaa, joka tulee M4-kierreruuveilla. Nämä eivät ole yhteensopivia AM5-taustalevyssä käytetyn UNC 6-32 -kierteen kanssa. AM5 M4 -taustalevyllä voidaan käyttää sopivia CPU-jäähdyttimiä, erityisesti AiO-vesijäähdyttimiä.

Käytännöllinen AM5-sovittimen ja offset-kiinnityssarjan AMD:n AM5-kantaisiin emolevyihin sisältyy jäähdyttimen kiinnikkeet CPU:n offset-kiinnitystä varten sekä sovitusruuvit UNC 6-32 -kierretapista M3- ja M4-kierretappiin. Sovitusruuveja voidaan käyttää CPU-jäähdyttimien kiinnittämiseen, jotka vaativat M3 tai M4 -kierretapin sen sijaan, että ne olisivat UNC 6-32 -kierrejärjestelmän mukaisia. Offset-telineiden avulla yhteensopivat CPU-jäähdyttimet voidaan valinnaisesti asentaa prosessorille optimoidakseen jäähdytystehokkuutta. Ryzen-prosessoreiden chiplet-suunnittelun esittelyn jälkeen lämpölevyn kuumimman pisteen ei enää ole keskellä, vaan se on hieman alaspäin siirretty ja riippuen prosessorista myös reunalle päin.

Short back plate for AM5 motherboard, for mounting AM4 coolers with custom retaining kit on AM5, made from black anodised aluminium

Thermal pad with extremely high thermal conductivity and outstanding compressibility, electrically non-conductive and easy to apply for efficient heat transfer in electronic components.

The Minus Pad Pro builds on the proven Minus Pad 8 to deliver improved thermal performance and surface conformity, making it suitable for SSDs, GPU coolers, water-cooling blocks, voltage regulators and memory modules.

• Excellent thermal conductivity


• Outstanding compressibility for better surface contact


• Electrically non-conductive


• Easy to use and install


• Designed for use with SSDs, GPUs, water coolers and electronic components


• Part of the Minus Pad Basic, Advance and Pro series; further developed from Minus Pad 8

Gray material adapts to uneven surfaces to improve contact between components and heatsinks for more reliable heat transfer.

Lämpöäjohtava sovitinpala (thermal pad), punaruskea

Lämpöäjohtava sovitinpala (thermal pad), punaruskea

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Lämpöäjohtava sovitinpala (thermal pad), musta (pakkaus sisältää 4)

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Thermal pad with extremely high thermal conductivity, outstanding compressibility and electrical non-conductivity for reliable heat transfer on SSDs, GPU coolers and electronic components.

The Minus Pad Pro is part of the Minus Pad series and builds on the proven Minus Pad 8 to deliver improved thermal conductivity and compressibility while remaining easy to use.

• Excellent thermal conductivity


• Outstanding compressibility


• Easy to use


• Electrically non-conductive


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules


• Color: gray

Provides a compressible, electrically isolating interface to enhance thermal contact between components and cooling solutions.

Thermal pad delivering excellent thermal conductivity and outstanding compressibility while remaining electrically non-conductive and easy to apply.

The Minus Pad Pro is part of the Minus Pad series, developed from the proven Minus Pad 8 to boost thermal performance and compressibility for components such as SSDs, GPU coolers, GPU water-cooling setups, voltage regulators and memory modules.

• Excellent thermal conductivity for efficient heat transfer


• Outstanding compressibility for tight-gap filling


• Electrically non-conductive for safe use on electronics


• Easy to use and install


• Color: gray

Provides a reliable thermal interface between electronic components and cooling solutions to enhance heat dissipation in compact assemblies.

The Intel 1851 Delid-Die-Mate V1 is a tool for removing the heat spreader (delidding) from Intel processors in the "Intel Core Ultra 200" series (LGA1851 socket). By removing the Integrated Heat Spreader (IHS), CPUs can be cooled using the "Direct-Die" method, where the cooler is mounted directly onto the processor chip. This enables the most efficient transfer of thermal dissipation power (TDP), or simply put, the heat, from the processor to the cooling loop.

 

Caution: Removing the heat spreader (delidding) of a processor is done at your own risk! Delidding the CPU voids the manufacturer's warranty! Damage caused during delidding is not covered by the manufacturer! CPU should be heated. 

Thermal pads offering extremely high thermal conductivity, outstanding compressibility and electrically non-conductive properties for use on SSDs, GPU coolers and electronic components.

The Minus Pad Pro combines excellent heat transfer with exceptional compressibility while remaining electrically non-conductive, making it suitable for cooling SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules.

• Excellent thermal conductivity


• Outstanding compressibility for tight contact


• Electrically non-conductive for safe use on electronics


• Easy to use


• Designed for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules

Based on the proven Minus Pad 8 and developed to further improve thermal conductivity and compressibility for reliable component cooling.

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Lämpöäjohtava sovitinpala (thermal pad), punaruskea

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Thermal pad delivering excellent thermal conductivity and outstanding compressibility for efficient heat transfer in SSDs, GPU coolers and other electronic components.

The Minus Pad Pro is an electrically non-conductive thermal pad developed to improve thermal conductivity and compressibility while remaining easy to apply.

• Excellent thermal conductivity


• Outstanding compressibility for reliable contact


• Electrically non-conductive


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules

Easy-to-use design ensures consistent thermal contact across a range of cooling and electronic applications.

Lämpötyyny tarjoaa korkean puristuskyvyn, erittäin korkean kokoonpuristuvuuden ja lämmönjohtavuuden sähköä johtamattomassa rakenteessa helppoa asennusta varten.

Thermal Grizzly Minus Pad High Compression on suunniteltu PC-harrastajille ja modaajille, jotka tarvitsevat joustavan tyynyn, joka kompensoi luotettavasti vaihtelevia komponenttikorkeuksia ilman monimutkaisia mittauksia, ja jonka voi leikata sopivaan kokoon monenlaisiin kokoonpanoihin.

• Korkea kokoonpuristuvuus auttaa kompensoimaan korkeuseroja, kun tarkkaa välystä ei tiedetä
• Erinomainen lämmönjohtavuus tukee tehokasta lämmönvaihtoa
• Sähköä johtamaton, auttaa ehkäisemään oikosulkuja herkissä elektroniikkalaitteissa
• Monipuolinen käyttö SSD-levyille, kannettaville, VRM-komponenteille ja näytönohjaimille

Ihanteellinen käytännöllisiin jäähdytyspäivityksiin, joissa toleranssit, turvallisuus ja helppo käsiteltävyys ovat tärkeitä.

The Intel 1851 Delid-Die-Mate Heater V1 is a specially designed heating element for the Intel 1851 Delid-Die-Mate V1. The heater raises the temperature of both the CPU and the delidder to 165°C, the necessary temperature for delidding. The operation is controlled via a control unit with an OLED display, which is connected to the heater with two cables. A laptop/smartphone charger with at least 65 watts of power and a USB Type-C connector, which is not included, is required for the heater to operate. A small amount of thermal paste is also needed.

Heating element for warming the CPU
Designed for the Intel 1851 Delid-Die-Mate V1
Follow the warning instructions!
Scope of Delivery:

1x Intel 1851 Delid-Die-Mate Heater V1
1x Angle wrench
1x TG Cleaning Wipes
1x Kryonaut, 1g
Warning Instructions:

Note: When delidding with the Intel 1851 Delid-Die-Mate V1, the CPU should be heated to 165°C (the melting point of indium is 157°C) to liquefy the indium, making it easier to remove the heat spreader. This minimizes mechanical stress on the chip and helps prevent damage. Otherwise, there is a high risk that the CPU could be damaged during delidding.

Caution: delidding a CPU can be dangerous. Any damaged caused by this will not be covered by warranty. Make sure to ressearch how to before trying. 

Thermal pads offer extremely high thermal conductivity, outstanding compressibility, electrical insulation, and straightforward installation for efficient component cooling.

The Minus Pad Pro is the Pro-series thermal pad refined from the Minus Pad 8 to deliver improved thermal conductivity and compressibility for SSDs, GPU coolers, water blocks and electronic components.

• Excellent thermal conductivity


• Outstanding compressibility for tight contact


• Electrically non-conductive


• Easy to apply


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules

Designed to enhance heat transfer between components and cooling solutions in compact assemblies.

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

The heat spreader of the Ryzen 7000 processors is very thick, which is partly due to compatibility with older CPU coolers for the AM4 socket. The unnecessary thickness of the heat spreader reduces thermal conductivity, so the CPUs operate at very high temperatures, around 95 degrees Celsius. By removing the heat spreader ("decap", "delidding"), the CPU cooler can be mounted directly on the chiplets of Ryzen 7000 CPU, which drastically reduces temperatures. To avoid damage to sensitive chips and prevent operational problems (e.g., RAM), Ryzen 7000 Direct Die Frame replaces Socket Actuation Mechanism (SAM) on motherboard.

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

TG Minus Pad High Compression -sarjan lämpötyynyt yhdistävät poikkeuksellisen korkean kokoonpuristuvuuden ja erinomaisen lämmönjohtavuuden, myös voimakkaassa puristuksessa.

Vaihtelevien korkeuserojen silloittamiseen suunniteltuina nämä tyynyt ovat erityisen hyödyllisiä näytönohjainten muokkauksessa GPU-vesijäähdyttimellä tai GPU-jäähdyttimen lämpötyynyjen vaihdossa, ja auttavat ylläpitämään luotettavan kontaktin useiden komponenttien välillä samassa kokoonpanossa.

• Mukautuu hyvin korkeustoleransseihin
• Sähköä johtamaton
• Erittäin monipuolinen käytössä
• Helppo käsitellä

Ihanteellinen, kun tarvittava tarkka tyynypaksuus ei ole tiedossa; lämmönjohtavuus voi jopa kasvaa suuremman kosketuspaineen myötä.