Thermal Grizzly CPU-jäähdytys

The PhaseSheet PTM is a thermal pad based on a phase change material (PCM). The pads, which are solid at room temperature, can be easily applied and liquefy during operation, allowing them to effectively dissipate heat like a thermal paste. PhaseSheet PTM is electrically non-conductive and can therefore be used in many areas, with the primary application being in processors and graphics chips.

High-end thermal paste. Kryonaut thermal grease was created especially for the extremely demanding applications and the highest expectations of the overclocking community. Kryonaut is also highly recommended as a top product for critical cooling systems in the industrial environment.

• Designed for Overclocking
• Excellent thermal conductivity
• No curing
• Long-term durability
• No electrical conductivity!

Kryonaut uses a special structure, which halts the drying out process at temperatures of up to 80° Celsius. This structure is also responsible for the nano-aluminum- and zinc-oxide-parts included in the grease to compound optimally, to compensate for unevenness of the component (i.e. the CPU) or the heat sink, thus achieving remarkable heat transfer.
 

Lämpötahna Thermal Grizzly Duronaut Pro tarjoaa erinomaisen lämmönjohtavuuden, äärimmäisen pitkäaikaisstabiilisuuden, sähköä johtamattoman käytön eikä se kovetu ajan myötä.

Duronaut Pro on huippuluokan lämpötahna, joka on kehitetty pelaajille, ylikellottajille ja vaativiin teollisiin jäähdytysjärjestelmiin, ja se käyttää silikoniöljyä alumiinimikrojauheella ja sinkkioksidinanopulverilla.

• Minimoi pump-out-ilmiön optimoidulla hiukkasmuodolla ja -koolla
• Tukee ohuita levityskerroksia alhaista lämpökontaktivastusta varten
• Sisältää levittimen, TG Spatula ja TG Spatula Pro
• Sisältö: 2 g

Tehokkaaseen lämmönsiirtoon lämmönlähteen ja jäähdyttimen välillä suunniteltu Duronaut Pro auttaa ylläpitämään luotettavaa jäähdytystehoa ajan myötä.

Thermal putty that serves as an electrically non-conductive, flexible gap filler for replacing thermal pads on GPUs and compensates for height differences from 0.2 to 3.0 mm.

TG Putty is easy to apply with the supplied spatulas or by hand (gloves recommended) and is available in Basic, Advance and Pro variants that differ by thermal conductivity.

• Electrically non-conductive alternative to conventional thermal pads


• Fills gaps from 0.2–3.0 mm for VRAM, VRM and SMD components


• Apply broadly with spatulas or shape into small pellets for precise placement


• Not suitable for use on processors (IHS or Direct Die) or directly on the GPU die


• Operating temperature range −40°C to +120°C


• Advance variant includes three spatulas for application

Designed for GPU modifications and cooler conversions, it adapts to varied factory pad thicknesses for tailored thermal contact.

CPU contact sealing frame, punainen/musta, musta

The AM5 High Performance Heatspreader is an upgrade for AMD's Ryzen 7000 CPUs. The heatspreader's precision diamond-milled nickel-plated copper surface provides 240% more surface area. As a result, the AM5 heatspreader allows for maximum heat dissipation with air and water coolers.

Lämpötyynyt tarjoavat korkean lämmönjohtavuuden erittäin elastisella, joustavalla pinnalla, joka on suunniteltu kompensoimaan jopa pienimmät raot komponenttien välillä.

Thermal Grizzly Minus Pad 8 on helppo käsitellä ja kiinnittää kevyellä paineella. Se käyttää keraamista silikonikaavakompleksia ja nanoalumiinioksidia tukemaan jatkuvaa, optimaalista lämmönsiirtoa laajassa koko- ja paksuusvalikoimassa.

• Korkea lämmönjohtavuus
• Korkea kokoonpuristuvuus
• Sähköinen eristys
• RoHS-yhteensopiva

Luotettava kontakti ja tehokas lämmönsiirto auttavat pitämään herkät komponentit lämpöteknisesti kytkettyinä ja vakaina.

Lämpöäjohtava sovitinpala (thermal pad), punaruskea

Lämpötahna, suunniteltu ylikellotukseen, 14.2 W/m*K lämmönjohtavuus, ei kovettumista, 2 grammaa

The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity.

This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible.

• Outstanding thermal conductivity
• Easy to use
• Consistently high performance
• Extreme durability

Attention: Electrically conductive! Follow instructions!

Thermal putty acts as an electrically non-conductive, flexible gap filler for replacing thermal pads on GPUs and compensates height differences from 0.2 mm to 3.0 mm while remaining easy to apply.

The TG Putty line is available in three variants with differing thermal conductivity and is supplied with spatulas to enable straightforward, large-area application.

• Electrically non-conductive alternative to conventional thermal pads


• Compensates gaps from 0.2–3.0 mm


• Three variants: Basic (medium), Advance (good), Pro (excellent) thermal conductivity


• Includes three spatulas for application


• Operating temperature range −40°C to +120°C


• Not suitable for use on processors (IHS or Direct Die) or directly on the GPU die


• Apply only to clean, degreased surfaces (e.g., TG Cleaning Wipes or isopropanol)

Suited for replacing VRAM and VRM pads on single and larger graphics cards and for converting coolers to GPU water cooling setups.

Terminen pasta (thermal paste), vaalean harmaa

The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity.

This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible.

• Outstanding thermal conductivity
• Easy to use
• Consistently high performance
• Extreme durability

Attention: Electrically conductive! Follow instructions!

Lämpöäjohtava sovitinpala (thermal pad), punaruskea

Nestemäinen metallijäähdytyspasta, hopeatahna, tiheys: 6,29 g/cm³, käyttölämpötila: -50 - 200°C, 1 grammaa

Terminen pasta (thermal paste), vaalean harmaa

Thermal Grizzly TG Remove on asetonipohjainen nanopuhdistusaine, joka takaa parhaan mahdollisen puhdistustuloksen lämpötahnalle. Lisäksi TG Removella on rasvanpoistovaikutus, joka auttaa valmistelemaan pinnan uudelleen levitettävää lämpötahnaa varten esimerkiksi prosessoreille.

Digitaalinen työntömitta TG Caliper mittaa jopa 150 mm / 6 inches, LCD-näytöllä mm- tai inches-yksiköissä, ZERO-toiminnolla sekä ulko-, sisä-, porras- ja syvyysmittauksella PC DIY -tehtäviin.

Korkean kovuuden ABS-muovista valmistettu työntömitta on ruosteenkestävä, pöly- ja roiskeenkestävä IP54-luokituksen mukaisesti, ja siinä on ergonomisesti kuvioitu peukalotuki helpompaa käsittelyä varten.

• Resoluutio/näyttö 0.1 mm / 0.01 inch
• Tarkkuus ±0.2 mm / 0.01 inch
• Sopii lämpötyynyille, ruuveille ja putken seinämäpaksuudelle
• Toimii LR44-paristolla, mukana varaparisto

Selkeiden digitaalisten lukemien ja käytännöllisten mittaustoimintojen ansiosta TG Caliper helpottaa tarkkoja PC DIY -komponenttitarkistuksia.

Thermal Grizzly Duronaut is a high-performance thermal paste designed for excellent heat transfer and long-term stability.

Key features:
✔ Extremely durable
✔ High thermal conductivity
✔ Non-conductive & safe for electronics

Package includes:

1x Duronaut thermal paste 6g
1x Applicator
1x TG Spatula
1x TG Spatula Pro
 

Thermal pad with extremely high thermal conductivity and outstanding compressibility, electrically non-conductive and easy to apply for efficient heat transfer in electronic components.

The Minus Pad Pro builds on the proven Minus Pad 8 to deliver improved thermal performance and surface conformity, making it suitable for SSDs, GPU coolers, water-cooling blocks, voltage regulators and memory modules.

• Excellent thermal conductivity


• Outstanding compressibility for better surface contact


• Electrically non-conductive


• Easy to use and install


• Designed for use with SSDs, GPUs, water coolers and electronic components


• Part of the Minus Pad Basic, Advance and Pro series; further developed from Minus Pad 8

Gray material adapts to uneven surfaces to improve contact between components and heatsinks for more reliable heat transfer.

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

Thermally conductive gap filler to replace GPU thermal pads, with an operating temperature range of -40°C to +120°C.

TG Putty is a thermally conductive compound intended for GPU applications, offered in multiple sizes and performance variants.

• Replaces standard GPU thermal pads to bridge uneven surfaces


• Operating temperature: -40°C to +120°C


• Available contents: 30 g and 100 g


• Available variants: Basic, Advance, Pro


• Datasheet and technical information available for download

Ensures reliable thermal contact across gaps to support heat transfer between GPU components.

Lämpöäjohtava sovitinpala (thermal pad), punaruskea (pakkaus sisältää 2)

CPU contact frame for LGA 1851 (Intel 200 series). Can help improve cooling performance with better contact between CPU and cooler.

 Included in the package:

• 1x Intel 1851 CPU Contact Frame V1
• 4x Cylinder head screws with 3/8" UNC threads
• 1x 5/64" hex key
• 1x Torx T20 key

CPU-kontaktikehys Intel 13th gen Raptor Lake & 14th gen Raptor Lake-S, voi auttaa parantamaan jäähdytyksen suorituskykyä paremman kosketuksen avulla CPU:n ja jäähdyttimen välillä - katso asennusvideo ennen asennusta.