Thermal Grizzly CPU-jäähdytys

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

The PhaseSheet PTM is a thermal pad based on a phase change material (PCM). The pads, which are solid at room temperature, can be easily applied and liquefy during operation, allowing them to effectively dissipate heat like a thermal paste. PhaseSheet PTM is electrically non-conductive and can therefore be used in many areas, with the primary application being in processors and graphics chips.

Aeronaut thermal grease is the ideal beginner's product with high effectiveness. Great surface protection, as well as good heat transfer capabilites make Aeronaut the ideal choice for users who want to optimize their cooling solution in an effective way, or maybe want to use an alternative to the thermal grease included with their hardware, with a remarkable cost effectiveness to boot.

• very good thermal conductivity
• long-term durability
• no curing
• no electrical conductivity

Thermal putty that serves as an electrically non-conductive, flexible gap filler for replacing thermal pads on GPUs and compensates for height differences from 0.2 to 3.0 mm.

TG Putty is easy to apply with the supplied spatulas or by hand (gloves recommended) and is available in Basic, Advance and Pro variants that differ by thermal conductivity.

• Electrically non-conductive alternative to conventional thermal pads


• Fills gaps from 0.2–3.0 mm for VRAM, VRM and SMD components


• Apply broadly with spatulas or shape into small pellets for precise placement


• Not suitable for use on processors (IHS or Direct Die) or directly on the GPU die


• Operating temperature range −40°C to +120°C


• Advance variant includes three spatulas for application

Designed for GPU modifications and cooler conversions, it adapts to varied factory pad thicknesses for tailored thermal contact.

High-end thermal paste. Kryonaut thermal grease was created especially for the extremely demanding applications and the highest expectations of the overclocking community. Kryonaut is also highly recommended as a top product for critical cooling systems in the industrial environment.

• Designed for Overclocking
• Excellent thermal conductivity
• No curing
• Long-term durability
• No electrical conductivity!

Kryonaut uses a special structure, which halts the drying out process at temperatures of up to 80° Celsius. This structure is also responsible for the nano-aluminum- and zinc-oxide-parts included in the grease to compound optimally, to compensate for unevenness of the component (i.e. the CPU) or the heat sink, thus achieving remarkable heat transfer.
 

Thermal putty is an electrically non-conductive, flexible gap filler that replaces conventional thermal pads on GPUs and bridges height differences from 0.2 to 3.0 mm.

Formulated for GPU modifications, TG Putty is easy to shape for precise contact with VRAM and SMD components and can be applied broadly with a spatula or formed by hand.

• Electrically non-conductive alternative to thermal pads


• Fills gaps from 0.2 to 3.0 mm for consistent contact


• Apply with spatulas or by hand (gloves recommended)


• Available in variants with different thermal conductivities


• Operating range −40°C to +120°C


• Not suitable for use on processors (IHS or direct die) or directly on the GPU die

Easy to shape and tailor-made for memory and voltage-regulator contacts, it simplifies GPU pad replacement and cooler modifications.

CPU Contact Frame improves cooling by shifting contact pressure to the edges, preventing IHS concavity and enabling better cooler contact on Intel LGA1700 sockets.

The Thermal Grizzly CPU Contact Frame Intel 1700 LT is the injection-molded "Lite" mounting frame made from ABS reinforced with 15% glass fiber that replaces the standard ILM to increase contact surface and simplify installation.

• Injection-molded ABS with 15% glass fiber for added stability


• Inner contour shifts pressure from centre to edges to avoid concave IHS


• Designed for Intel LGA1700; compatible with 12th, 13th and 14th Gen CPUs


• Only for CPUs whose IHS has been ground down by no more than 0.2 mm


• Includes 4 pan-head screws (UNC 3/8"), 5/64" hex socket wrench and Torx T20 angle wrench

Simple installation and improved cooler contact can lead to noticeably lower CPU temperatures depending on the cooler and processor.

Nestemäinen metallijäähdytyspasta, hopeatahna, tiheys: 6,29 g/cm³, käyttölämpötila: -50 - 200°C, 1 grammaa

Thermal Grizzly Duronaut is a high-performance thermal paste designed for excellent heat transfer and long-term stability.

Key features:
✔ Extremely durable
✔ High thermal conductivity
✔ Non-conductive & safe for electronics

Package includes:

1 × Duronaut thermal paste 2 g
1 × Applicator
1 × TG Spatula
1 × TG Spatula Pro

Thermal Grizzly TG Shield on korkean lämpötilan konformaalipinnoite, joka suojaa komponentteja nestemäisen metallin oikosulkuilta. TG Shield kuivuu nopeasti ja tarjoaa luotettavan suojan PC-komponenteille yhdessä nestemäisen metallin kanssa.

Thermal putty acts as an electrically non-conductive, flexible gap filler for replacing thermal pads on GPUs and compensates height differences from 0.2 mm to 3.0 mm while remaining easy to apply.

The TG Putty line is available in three variants with differing thermal conductivity and is supplied with spatulas to enable straightforward, large-area application.

• Electrically non-conductive alternative to conventional thermal pads


• Compensates gaps from 0.2–3.0 mm


• Three variants: Basic (medium), Advance (good), Pro (excellent) thermal conductivity


• Includes three spatulas for application


• Operating temperature range −40°C to +120°C


• Not suitable for use on processors (IHS or Direct Die) or directly on the GPU die


• Apply only to clean, degreased surfaces (e.g., TG Cleaning Wipes or isopropanol)

Suited for replacing VRAM and VRM pads on single and larger graphics cards and for converting coolers to GPU water cooling setups.

The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity.

This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible.

• Outstanding thermal conductivity
• Easy to use
• Consistently high performance
• Extreme durability

Attention: Electrically conductive! Follow instructions!

Lämpöäjohtava sovitinpala (thermal pad), punaruskea (pakkaus sisältää 2)

Thermal pads deliver electrically non-conductive heat transfer with improved thermal conductivity, high compressibility and straightforward application.

The Minus Pad Advance series builds on the proven Minus Pad 8 and offers enhanced thermal conductivity and compressibility compared to the Basic pads, suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules.

• Electrically non-conductive material


• Improved thermal conductivity


• High compressibility for uneven surfaces


• Easy to use and cut to size


• Size: 120 x 20 mm · Thickness: 2.0 mm · Color: black


• Pack content: 4 pcs

Ideal for reliable thermal coupling across a range of electronic components where consistent heat transfer is needed.

CPU-kontaktikehys Intel 13th gen Raptor Lake & 14th gen Raptor Lake-S, voi auttaa parantamaan jäähdytyksen suorituskykyä paremman kosketuksen avulla CPU:n ja jäähdyttimen välillä - katso asennusvideo ennen asennusta.

The Intel High Performance Heatspreader V1 is an upgrade heatspreader for Intel processors. The nickel-plated copper heatspreader has a 207 percent larger, diamond-milled precision surface. This increased surface area compared to the original heatspreader enables maximum heat dissipation for air and water coolers, while the precision milling ensures extremely low surface roughness for the best contact with the heat sink.

The Intel High Performance Heatspreader V1 is compatible with the following processors:

Intel 12th Gen CPUs
Intel 13th Gen CPUs
Intel 14th Gen CPUs (200s)

Scope of delivery

1x Intel High Performance Heatspreader V1
4x pan-head screws UNC thread 3/8"
1x hexagon socket wrench 5/64"
1x angle wrench Torx T20
 

CPU contact frame for LGA 1851 (Intel 200 series). Can help improve cooling performance with better contact between CPU and cooler.

 Included in the package:

• 1x Intel 1851 CPU Contact Frame V1
• 4x Cylinder head screws with 3/8" UNC threads
• 1x 5/64" hex key
• 1x Torx T20 key

CPU contact sealing frame, punainen/musta, musta

The AM5 High Performance Heatspreader is an upgrade for AMD's Ryzen 7000 CPUs. The heatspreader's precision diamond-milled nickel-plated copper surface provides 240% more surface area. As a result, the AM5 heatspreader allows for maximum heat dissipation with air and water coolers.

Lämpötahna, suunniteltu ylikellotukseen, 14.2 W/m*K lämmönjohtavuus, ei kovettumista, 2 grammaa

Thermal Grizzly Duronaut is a high-performance thermal paste designed for excellent heat transfer and long-term stability.

Key features:
✔ Extremely durable
✔ High thermal conductivity
✔ Non-conductive & safe for electronics

Package includes:

1x Duronaut thermal paste 6g
1x Applicator
1x TG Spatula
1x TG Spatula Pro
 

Lämpöäjohtava sovitinpala (thermal pad), punaruskea

Lämpötahna, suunniteltu ylikellotukseen, 14,2 W/m*K lämmönjohtavuus, ei kovettumista, 33.84 grammaa

The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity.

This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible.

• Outstanding thermal conductivity
• Easy to use
• Consistently high performance
• Extreme durability

Attention: Electrically conductive! Follow instructions!

Lämpöäjohtava sovitinpala (thermal pad), punaruskea