Thermal Grizzly CPU-jäähdytys

Water cooler optimized for Intel LGA1851 direct-die mounting with a nickel-plated copper microfin cold plate, low-flow-resistance jet channels and integrated RGB lighting.

The Intel 1851 Mycro Direct-Die Pro RGB V1 is designed to sit directly on a delidded Intel CPU to send heat straight into the water loop, with an acrylic-and-aluminum cover and controllable ARGB illumination.

• Direct-die installation for LGA1851 CPUs — requires removal of the ILM and CPU heatspreader; delidding is at your own risk


• Nickel-plated copper cold plate with microfins and a jet system, engineered for low flow resistance


• Acrylic layer tempered after milling to prevent stress cracks beneath the anodized aluminum lid


• Digital aRGB LEDs under the lid, controllable via a 3-pin ARGB header (+5V/DATA/GND); LEDs also illuminate the G1/4 fittings


• G1/4-inch female threading for standard fittings


• Tested with KryoSheet and thermal pads — additional pad thickness affected contact pressure and showed no significant temperature improvements

Built for users who want a compact direct cooling path from the CPU die into a water loop while retaining customizable RGB lighting.

Thermal pads provide improved thermal conductivity and high compressibility for efficient heat transfer in SSDs, GPU coolers, water coolers and other electronic components.

The electrically non-conductive Minus Pad Advance builds on the proven Minus Pad 8 design and was developed to improve thermal conductivity and compressibility while remaining easy to use.

• Excellent thermal conductivity


• High compressibility for uneven surfaces


• Easy to apply and handle


• Electrically non-conductive


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules

Designed for straightforward installation, these pads help maintain effective thermal contact across a range of PC and electronics cooling applications.

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

High-end thermal paste. Kryonaut thermal grease was created especially for the extremely demanding applications and the highest expectations of the overclocking community. Kryonaut is also highly recommended as a top product for critical cooling systems in the industrial environment.

• Designed for Overclocking
• Excellent thermal conductivity
• No curing
• Long-term durability
• No electrical conductivity!

Kryonaut uses a special structure, which halts the drying out process at temperatures of up to 80° Celsius. This structure is also responsible for the nano-aluminum- and zinc-oxide-parts included in the grease to compound optimally, to compensate for unevenness of the component (i.e. the CPU) or the heat sink, thus achieving remarkable heat transfer.
 

The PhaseSheet PTM is a thermal pad based on a phase change material (PCM). The pads, which are solid at room temperature, can be easily applied and liquefy during operation, allowing them to effectively dissipate heat like a thermal paste. PhaseSheet PTM is electrically non-conductive and can therefore be used in many areas, with the primary application being in processors and graphics chips.

Lämpöäjohtava sovitinpala (thermal pad), punaruskea (pakkaus sisältää 2)

Aeronaut thermal grease is the ideal beginner's product with high effectiveness. Great surface protection, as well as good heat transfer capabilites make Aeronaut the ideal choice for users who want to optimize their cooling solution in an effective way, or maybe want to use an alternative to the thermal grease included with their hardware, with a remarkable cost effectiveness to boot.

• very good thermal conductivity
• long-term durability
• no curing
• no electrical conductivity

Thermal putty that serves as an electrically non-conductive, flexible gap filler for replacing thermal pads on GPUs and compensates for height differences from 0.2 to 3.0 mm.

TG Putty is easy to apply with the supplied spatulas or by hand (gloves recommended) and is available in Basic, Advance and Pro variants that differ by thermal conductivity.

• Electrically non-conductive alternative to conventional thermal pads


• Fills gaps from 0.2–3.0 mm for VRAM, VRM and SMD components


• Apply broadly with spatulas or shape into small pellets for precise placement


• Not suitable for use on processors (IHS or Direct Die) or directly on the GPU die


• Operating temperature range −40°C to +120°C


• Advance variant includes three spatulas for application

Designed for GPU modifications and cooler conversions, it adapts to varied factory pad thicknesses for tailored thermal contact.

Thermal putty is an electrically non-conductive, flexible gap filler that replaces conventional thermal pads on GPUs and bridges height differences from 0.2 to 3.0 mm.

Formulated for GPU modifications, TG Putty is easy to shape for precise contact with VRAM and SMD components and can be applied broadly with a spatula or formed by hand.

• Electrically non-conductive alternative to thermal pads


• Fills gaps from 0.2 to 3.0 mm for consistent contact


• Apply with spatulas or by hand (gloves recommended)


• Available in variants with different thermal conductivities


• Operating range −40°C to +120°C


• Not suitable for use on processors (IHS or direct die) or directly on the GPU die

Easy to shape and tailor-made for memory and voltage-regulator contacts, it simplifies GPU pad replacement and cooler modifications.

Thermal Grizzly Duronaut is a high-performance thermal paste designed for excellent heat transfer and long-term stability.

Key features:
✔ Extremely durable
✔ High thermal conductivity
✔ Non-conductive & safe for electronics

Package includes:

1 × Duronaut thermal paste 2 g
1 × Applicator
1 × TG Spatula
1 × TG Spatula Pro

Lämpöäjohtava sovitinpala (thermal pad), punaruskea

Thermal putty acts as an electrically non-conductive, flexible gap filler for replacing thermal pads on GPUs and compensates height differences from 0.2 mm to 3.0 mm while remaining easy to apply.

The TG Putty line is available in three variants with differing thermal conductivity and is supplied with spatulas to enable straightforward, large-area application.

• Electrically non-conductive alternative to conventional thermal pads


• Compensates gaps from 0.2–3.0 mm


• Three variants: Basic (medium), Advance (good), Pro (excellent) thermal conductivity


• Includes three spatulas for application


• Operating temperature range −40°C to +120°C


• Not suitable for use on processors (IHS or Direct Die) or directly on the GPU die


• Apply only to clean, degreased surfaces (e.g., TG Cleaning Wipes or isopropanol)

Suited for replacing VRAM and VRM pads on single and larger graphics cards and for converting coolers to GPU water cooling setups.

Lämpötahna, Thermal Grizzly Duronaut Pro 6g, yhdistää erinomaisen lämmönjohtavuuden, äärimmäisen pitkäaikaisstabiilisuuden, sähköä johtamattomuuden eikä se kovetu ajan myötä vaativiin PC- ja teollisiin jäähdytysjärjestelmiin.

Sen erityisesti kehitetty silikoniöljy, alumiinimikrojauhe ja sinkkioksidinanopulveri auttavat minimoimaan pump-out-ilmiön, parantamaan tarttuvuutta pintaan ja vähentämään lämpökontaktivastusta.

Pakkaus sisältää Duronaut Pro 6g, levittimen, TG Spatula ja TG Spatula Pro tehokkaaseen levitykseen ohuina levityskerroksina.

Ihanteellinen pelaajille, ylikellottajille ja vaativiin jäähdytyskokoonpanoihin, jotka tarvitsevat kestävää ja tehokasta lämmönsiirtoa CPU:n ja jäähdyttimen välillä.

Lämpöäjohtava sovitinpala (thermal pad), punaruskea

The AM5 High Performance Heatspreader is an upgrade for AMD's Ryzen 7000 CPUs. The heatspreader's precision diamond-milled nickel-plated copper surface provides 240% more surface area. As a result, the AM5 heatspreader allows for maximum heat dissipation with air and water coolers.

CPU contact sealing frame, punainen/musta, musta

Lämpötahna Thermal Grizzly Duronaut Pro tarjoaa erinomaisen lämmönjohtavuuden, äärimmäisen pitkäaikaisstabiilisuuden, sähköä johtamattoman käytön eikä se kovetu ajan myötä.

Duronaut Pro on huippuluokan lämpötahna, joka on kehitetty pelaajille, ylikellottajille ja vaativiin teollisiin jäähdytysjärjestelmiin, ja se käyttää silikoniöljyä alumiinimikrojauheella ja sinkkioksidinanopulverilla.

• Minimoi pump-out-ilmiön optimoidulla hiukkasmuodolla ja -koolla
• Tukee ohuita levityskerroksia alhaista lämpökontaktivastusta varten
• Sisältää levittimen, TG Spatula ja TG Spatula Pro
• Sisältö: 2 g

Tehokkaaseen lämmönsiirtoon lämmönlähteen ja jäähdyttimen välillä suunniteltu Duronaut Pro auttaa ylläpitämään luotettavaa jäähdytystehoa ajan myötä.

CPU Contact Frame improves cooling by shifting contact pressure to the edges, preventing IHS concavity and enabling better cooler contact on Intel LGA1700 sockets.

The Thermal Grizzly CPU Contact Frame Intel 1700 LT is the injection-molded "Lite" mounting frame made from ABS reinforced with 15% glass fiber that replaces the standard ILM to increase contact surface and simplify installation.

• Injection-molded ABS with 15% glass fiber for added stability


• Inner contour shifts pressure from centre to edges to avoid concave IHS


• Designed for Intel LGA1700; compatible with 12th, 13th and 14th Gen CPUs


• Only for CPUs whose IHS has been ground down by no more than 0.2 mm


• Includes 4 pan-head screws (UNC 3/8"), 5/64" hex socket wrench and Torx T20 angle wrench

Simple installation and improved cooler contact can lead to noticeably lower CPU temperatures depending on the cooler and processor.

The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity.

This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible.

• Outstanding thermal conductivity
• Easy to use
• Consistently high performance
• Extreme durability

Attention: Electrically conductive! Follow instructions!

Thermal pads with improved thermal conductivity, high compressibility and electrical insulation for effective heat transfer on SSDs, GPU coolers and electronic components.

The Minus Pad Advance pads are easy to use and were developed from the Minus Pad 8 to deliver improved thermal conductivity and higher compressibility.

• Excellent thermal conductivity


• High compressibility for better surface contact


• Electrically non-conductive


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules


• Improved price-performance ratio

Designed to provide reliable heat transfer and gap filling across a range of PC and electronic cooling applications.

CPU-kontaktikehys Intel 13th gen Raptor Lake & 14th gen Raptor Lake-S, voi auttaa parantamaan jäähdytyksen suorituskykyä paremman kosketuksen avulla CPU:n ja jäähdyttimen välillä - katso asennusvideo ennen asennusta.

Lämpötahna

Lämpötahna, suunniteltu ylikellotukseen, 14.2 W/m*K lämmönjohtavuus, ei kovettumista, 2 grammaa

Nestemäinen metallijäähdytyspasta, hopeatahna, tiheys: 6,29 g/cm³, käyttölämpötila: -50 - 200°C, 1 grammaa

Lämpötahna, suunniteltu ylikellotukseen, 14,2 W/m*K lämmönjohtavuus, ei kovettumista, 33.84 grammaa