Thermal Grizzly CPU-jäähdytys - sivu 2

Suorittimen jäähdytyslevyn tahna, hopea

Thermal putty is an electrically non-conductive, flexible gap filler that replaces conventional thermal pads on GPUs and bridges height differences from 0.2 to 3.0 mm.

Formulated for GPU modifications, TG Putty is easy to shape for precise contact with VRAM and SMD components and can be applied broadly with a spatula or formed by hand.

• Electrically non-conductive alternative to thermal pads


• Fills gaps from 0.2 to 3.0 mm for consistent contact


• Apply with spatulas or by hand (gloves recommended)


• Available in variants with different thermal conductivities


• Operating range −40°C to +120°C


• Not suitable for use on processors (IHS or direct die) or directly on the GPU die

Easy to shape and tailor-made for memory and voltage-regulator contacts, it simplifies GPU pad replacement and cooler modifications.

Water cooler optimized for Intel LGA1851 direct-die mounting with a nickel-plated copper microfin cold plate, low-flow-resistance jet channels and integrated RGB lighting.

The Intel 1851 Mycro Direct-Die Pro RGB V1 is designed to sit directly on a delidded Intel CPU to send heat straight into the water loop, with an acrylic-and-aluminum cover and controllable ARGB illumination.

• Direct-die installation for LGA1851 CPUs — requires removal of the ILM and CPU heatspreader; delidding is at your own risk


• Nickel-plated copper cold plate with microfins and a jet system, engineered for low flow resistance


• Acrylic layer tempered after milling to prevent stress cracks beneath the anodized aluminum lid


• Digital aRGB LEDs under the lid, controllable via a 3-pin ARGB header (+5V/DATA/GND); LEDs also illuminate the G1/4 fittings


• G1/4-inch female threading for standard fittings


• Tested with KryoSheet and thermal pads — additional pad thickness affected contact pressure and showed no significant temperature improvements

Built for users who want a compact direct cooling path from the CPU die into a water loop while retaining customizable RGB lighting.

Grease spatula (pakkaus sisältää 3)

Kapton Insulation Sheet is a polyamide film that can be used at high temperatures up to 280 degrees Celsius and acts as an assembly aid for electrically conductive thermal interface material (TIM). It is ideal for covering components such as SMDs on a CPU or GPU if they are to be used with Conductonaut liquid metal, Carbonaut or KryoSheet.

Brief Informations:

• 50 adhesive strips 10x60mm
• Thickness of 40µm
• Electrically insulating
• Max Temp: 280°C
• Breakdown voltage: Over 1 kV
• Clean the adhesive surface beforehand!

Scope of delivery

• 10x carrier foil with  5 Kapton Insulation Sheets each
   

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

Lämpötahna, Thermal Grizzly Duronaut Pro 6g, yhdistää erinomaisen lämmönjohtavuuden, äärimmäisen pitkäaikaisstabiilisuuden, sähköä johtamattomuuden eikä se kovetu ajan myötä vaativiin PC- ja teollisiin jäähdytysjärjestelmiin.

Sen erityisesti kehitetty silikoniöljy, alumiinimikrojauhe ja sinkkioksidinanopulveri auttavat minimoimaan pump-out-ilmiön, parantamaan tarttuvuutta pintaan ja vähentämään lämpökontaktivastusta.

Pakkaus sisältää Duronaut Pro 6g, levittimen, TG Spatula ja TG Spatula Pro tehokkaaseen levitykseen ohuina levityskerroksina.

Ihanteellinen pelaajille, ylikellottajille ja vaativiin jäähdytyskokoonpanoihin, jotka tarvitsevat kestävää ja tehokasta lämmönsiirtoa CPU:n ja jäähdyttimen välillä.

Lämpöäjohtava sovitinpala (thermal pad), punaruskea

Aeronaut thermal grease is the ideal beginner's product with high effectiveness. Great surface protection, as well as good heat transfer capabilites make Aeronaut the ideal choice for users who want to optimize their cooling solution in an effective way, or maybe want to use an alternative to the thermal grease included with their hardware, with a remarkable cost effectiveness to boot.

• very good thermal conductivity
• long-term durability
• no curing
• no electrical conductivity

Lämpöäjohtava sovitinpala (thermal pad), punaruskea

Short back plate for AM5 motherboard, for mounting AM4 coolers with custom retaining kit on AM5, made from black anodised aluminium

Lämpötahna

Thermal Grizzly Duronaut is a high-performance thermal paste designed for excellent heat transfer and long-term stability.

Key features:
✔ Extremely durable
✔ High thermal conductivity
✔ Non-conductive & safe for electronics

Package includes:

1 × Duronaut thermal paste 2 g
1 × Applicator
1 × TG Spatula
1 × TG Spatula Pro

Thermal Grizzly TG Shield on korkean lämpötilan konformaalipinnoite, joka suojaa komponentteja nestemäisen metallin oikosulkuilta. TG Shield kuivuu nopeasti ja tarjoaa luotettavan suojan PC-komponenteille yhdessä nestemäisen metallin kanssa.

Lämpöäjohtava sovitinpala (thermal pad), punaruskea

Lämpötahna, suunniteltu ylikellotukseen, 14,2 W/m*K lämmönjohtavuus, ei kovettumista, 33.84 grammaa

Lämpöäjohtava sovitinpala (thermal pad), punaruskea

The Intel 1851 Delid-Die-Mate V1 is a tool for removing the heat spreader (delidding) from Intel processors in the "Intel Core Ultra 200" series (LGA1851 socket). By removing the Integrated Heat Spreader (IHS), CPUs can be cooled using the "Direct-Die" method, where the cooler is mounted directly onto the processor chip. This enables the most efficient transfer of thermal dissipation power (TDP), or simply put, the heat, from the processor to the cooling loop.

 

Caution: Removing the heat spreader (delidding) of a processor is done at your own risk! Delidding the CPU voids the manufacturer's warranty! Damage caused during delidding is not covered by the manufacturer! CPU should be heated. 

Terminen pasta (thermal paste), vaalean harmaa

With the Thermal Grizzly Minus Pad Advance, the Hamburg-based cooling specialist is expanding its product range with advanced thermal pads. Based on their predecessor, the Minus Pad 8, they have been further developed to significantly improve thermal conductivity.

The Minus Pad Advance is ideal for applications where thermal paste is difficult to apply or where a gap between the heat source and the heat sink needs to be bridged. It is therefore ideal for use with memory chips or voltage converters. It is based on a silicone-based carrier complex and aluminum oxide as a heat transfer medium, thus achieving thermal conductivity similar to thermal paste.

The Minus Pad is available in various dimensions and thicknesses from 0.5 to 3 millimeters. Since it works optimally even with minimal contact pressure and thermal conductivity is barely affected by the thickness, the choice of thickness should simply be tailored to the distance to be bridged.

Thermal pad with extremely high thermal conductivity, outstanding compressibility and electrical non-conductivity for reliable heat transfer on SSDs, GPU coolers and electronic components.

The Minus Pad Pro is part of the Minus Pad series and builds on the proven Minus Pad 8 to deliver improved thermal conductivity and compressibility while remaining easy to use.

• Excellent thermal conductivity


• Outstanding compressibility


• Easy to use


• Electrically non-conductive


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules


• Color: gray

Provides a compressible, electrically isolating interface to enhance thermal contact between components and cooling solutions.

Thermal pads deliver electrically non-conductive heat transfer with improved thermal conductivity, high compressibility and straightforward application.

The Minus Pad Advance series builds on the proven Minus Pad 8 and offers enhanced thermal conductivity and compressibility compared to the Basic pads, suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules.

• Electrically non-conductive material


• Improved thermal conductivity


• High compressibility for uneven surfaces


• Easy to use and cut to size


• Size: 120 x 20 mm · Thickness: 2.0 mm · Color: black


• Pack content: 4 pcs

Ideal for reliable thermal coupling across a range of electronic components where consistent heat transfer is needed.

Lämpöäjohtava sovitinpala (thermal pad), punaruskea

Nestemäinen metallijäähdytyspasta, hopeatahna, tiheys: 6,29 g/cm³, käyttölämpötila: -50 - 200°C, 5 grammaa

Lämpötyyny tarjoaa poikkeuksellisen korkean kokoonpuristuvuuden ja erinomaisen lämmönjohtavuuden, ja se on suunniteltu mukautumaan komponenttien vaihteleviin korkeuseroihin.

TG Minus Pad High Compression on erityisen käytännöllinen näytönohjainten muokkauksessa GPU-vesijäähdyttimellä tai GPU-jäähdyttimen tyynyjen vaihdossa, sillä yksi tyyny voi silloittaa useita toleransseja VRAM-muisteilla, jännitteensäätimillä ja muilla kosketuspinnoilla samassa kokoonpanossa.

• Säilyttää lämmönjohtavuuden voimakkaassa puristuksessa ja voi kasvaa suuremman kosketuspaineen myötä
• Mukautuu hyvin korkeustoleransseihin, kun tarkan tyynypaksuuden valinta on epävarmaa
• Sähköä johtamaton
• Helppo käsitellä ja erittäin monipuolinen käytössä

Tarjoaa luotettavan kontaktin epätasaisilla pinnoilla tasaisempaa lämmönsiirtoa varten vaativissa kokoonpanoissa.